A simple method for determination of thermal conductivity coefficients of dielectric films

MHS 2001 - Proceedings of 2001 International Symposium on Micromechatronics and Human Science

Volumn , Issue , 2001, Pages 109-116

  Pan, Chi Hsiang ^a   Tung, Chien Li ^b  

^a NATIONAL CHIN YI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b Graduate Institute of Precision Engineering   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC FILMS; DIELECTRIC MATERIALS; DOPING (ADDITIVES); MICROSTRUCTURE; SOCIAL SCIENCES; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS;

ANALYTICAL EXPRESSIONS; DIELECTRIC THIN FILMS; LATERAL DISPLACEMENTS; MICROMACHINING TECHNIQUES; RISING TEMPERATURES; SIMPLE METHOD; TEMPERATURE RISE; THERMAL CONDUCTIVITY COEFFICIENT;

THIN FILMS;

EID: 77949894591     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MHS.2001.965231     Document Type: Conference Paper

References (23)

1. Bean K. E., Hentzschei H. P., and Colman D., "Thermal and Electrical Anisotropy of Polycrystalline Silicon", J. Appl. Phys., vol. 40, pp.2358-2359, 1969.
2. Fug G, Gasparoux H and Piaud J J, "Thermal Variation Apparatus for X-ray Diffraction Experiments up to 3000K, " J. Phys., E: Sci. Instrum. 5, pp. 12223.
3. Kinzly R.E., 1967, "A new interferometer capable of measuring small optical path differences, "Appl. Opt. 6, pp. 137-140, 1972.
4. Retajczyk T. F Jr., A. K. Sinha, "Elastic stiffness and thermal expansion coefficient of BN films, " Appl. Phys. Lett. 36, pp.161-163, 1980.
5. Wolf S. and Tauber R. N., Silicon Processing for the VLSI Era: Volume 1- Process Technology, Lattice Press, 1986.
6. Type R. P. and Maesono A., "The Impact of New Application on Thermal Properties Data Requirements", IEEE Intersociety Conference on Thermal Phenomena, pp.253-256, 1992.
7. Goodson K. E., Flik M. I., Su L. T. and Antoniadis D. A., "Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers", IEEE Electron Device Lett., Vol. 14, pp. 490-492, 1993.
8. Michael B. K., Stefan A. K. and Wener W., "Thermal Conductivity of Thin Silicon in Integrated Circuits", IEEE Transactions on Electron Devices, Vol. 43, No. 9, pp.1602, 1996.
9. Lee S. M. and Cahill D. G., "Heat Transport in Thin Dielectric Films", J. Appl. Phys., Vol. 81, pp.2590-2595, 1997.
10. Tai Y. C., Mastrangelo C. H., and Muller R. S., "Thermal Conductivity of Heavily Doped Low-Pressure Chemical Vapor Deposited Polycrystalline Silicon Films", J. Appl. Phys. 63(5), 1, pp. 1441-1447, 1988.
11. Friedemann Volklein and Henry Baltes, "A Microstructure for Measurement of Thermal Conductivity of Polysilicon Thin Films", J. Microelectromechanical Systems, Vol.1, No.4, pp.193-196, 1992.
12. Paul O. M., Korvink J. G., and Baltes H., "Determination of thermophysical properties of CMOS IC Polysilicon", Sensors and Actuators, 41-42, pp.161-164, 1994.
13. Paul O., M. Von Arx and H. Baltes, "Process-dependent Thermal physical Properties of CMOS IC Thin Films", The 8th International Conference on Solid State Sensors and Actuators, Transducers'95, Stockholm, Sweden, pp.178-181.
14. Paul O. M., and Baltes H., "Thremal Conductivity of CMOS Materials for the Optimization of Microsensors", J. Micromech. Microeng. pp. 110-112, 1993.
15. Baltes H., Paul O. and Korvink J. G. "Simulation Toolbox and Material Parameter Data Base for CMOS MEMS", IEEE 7Ul International Symposium on Micro Machine and Human Science, pp. 1 -8, 1996.
16. Pan C. S., "A Simple Method for Determination of Thermal Conductivity Coefficients of Thin Films" will appear to ASME 2001 IMECE symposium on Fabrication and Testing of Micro-Electromechanical-Systems, Nov. 11-16, 2001, New York, USA.
17. Pan C. S. and Hsu W., "A Microstructure for in-situ Determination of Residual Strain", IEEE/ASME J. Microelectromechanical Systems, Vol. 8, No. 2, June, 1999, pp.200.
18. Pan C. S., "A Simple Method for in situ Determination of Linear Thermal Expansion Coefficients of Thin Films", The Symposium on Instrumentation, Measurements, and Sensors at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida, USA.
19. Fedder G K and Howe R T, "Thermal Assembly of Polysilicon Microstructures", Proc. Micro Electro Mechanical Systems (Nara), pp.63-68, 1991.
20. Baltes H., "CMOS vacuum sensors and other application of CMOS thermopiles", 7th Int. Conf. Solid-State Sensors and Actuators (Transducers' 93), Yokohama, Japan, June 7-10, 1993, pp.736-741.
21. Lin L., and Chiao M., "Electrothermal Responses of Line Shape Microstructures", Sensors and Actuators, A55, pp.31-41, 1996.
22. Huang Q. A. and Lee N. K. S., "Analysis and Design of Polysilicon thermal flexure actuator", Journal of Micromech. Microeng., pp. 64-70, 1999.
23. Chu W. H., Mehregany M., and Mullen R. L., "Analysis of tip deflection and force of a bimetallic cantilever microactuator", J. Micromech. Microeng. 3, pp:4-7, 1993.