Influence of air heat exchange upon on-chip measurement of thermal conductivity using MEMS test structures

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 615-618

  Roncaglia, A ^a   Cozzani, E ^a   Mancarella, F ^a   Passini, M ^a   Cardinali, G C ^a   Severi, M ^a  

^a CNR Consiglio Nazionale delle Ricerche   (Italy)

Author keywords

Air environment; Micro test structures; Thermal conductivity

Indexed keywords

ACTUATORS; HEAT EXCHANGERS; MICROSYSTEMS; SENSORS; TESTING; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY; THICK FILMS; TRANSDUCERS;

AIR ENVIRONMENT; CONDUCTIVITY MEASUREMENTS; GAS-PHASE; HEAT EXCHANGING; IN-VACUUM; INTERNATIONAL CONFERENCES; MICRO TEST STRUCTURES; ON CHIP MEASUREMENTS; ON CHIPS; SOLID-STATE SENSORS; TEST STRUCTURES; THIN FILMS;

ELECTRONIC EQUIPMENT TESTING;

EID: 50049091176     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300205     Document Type: Conference Paper

References (3)

1. G. B. Xu, Q. A. Huang, "An Online Test Microstructure for Thermal Conductivity of Surface-Micromachined Polysilicon Thin Films", IEEE Sensors Journal, vol. 6, pp. 428-432, 2006.
2. th Daegu, Korea.
3. M. von Arx, O. Paul, H. Baltes, "Process-Dependent Thin-Film Thermal Conductivities for Thermal CMOS MEMS", Journal of Microelectromechanical Systems, vol. 9, pp. 136-145, 2000.