Thin-film thermal conductivity measurement using microelectrothermal test structures and finite-element-model-based data analysis

Journal of Microelectromechanical Systems

Volumn 16, Issue 5, 2007, Pages 1269-1275

  Stojanovic, Nenad ^a   Yun, Jongsin ^b   Washington, Erika B K ^c   Berg, Jordan M ^d   Holtz, Mark W ^a   Temkin, Henryk ^d  

^a TEXAS TECH UNIVERSITY   (United States)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^c UNIVERSITY OF ALBERTA   (Canada)

^d Department of Electrical and Computer Engineering   (United States)

Author keywords

Measurement; Microthermal devices; Thermal conductivity; Thermal variables measurement; Thin films

Indexed keywords

ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; HEAT TRANSFER; LEAST SQUARES APPROXIMATIONS; SILICON NITRIDE; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT;

MICROELECTROTHERMAL TEST STRUCTURE; MICROTHERMAL DEVICES;

METALLIC FILMS;

EID: 35148898908     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.900877     Document Type: Article

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