Efficient solution of inverse thermal problem via parametric model order reduction

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Volumn , Issue , 2009, Pages

  Bechtold, Tamara ^a   Hohlfeld, Dennis ^b   Rudnyi, Evgenii B ^c  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b HOLST CENTRE   (Netherlands)

^c CADFEM GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CONVECTION EFFECTS; FE MODEL; INVERSE THERMAL PROBLEM; MICRO HOTPLATE; OPTIMIZATION LOOP; ORDERS OF MAGNITUDE; PARAMETERIZED; PARAMETRIC MODELS; REDUCED MODEL; REDUCED ORDER MODELS; SIMULATION RESULT; TEST STRUCTURE; THERMAL PROPERTIES; THIN FILM MATERIAL; THREE DIMENSIONAL FINITE ELEMENTS; TRANSIENT SOLUTIONS; TRANSIENT TEMPERATURE;

HEAT TRANSFER; INTERCONNECTION NETWORKS; MICROELECTRONICS; MICROSYSTEMS; SILICON NITRIDE; TEMPERATURE MEASUREMENT; THERMODYNAMIC PROPERTIES;

SIMULATORS;

EID: 67650553645     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2009.4938461     Document Type: Conference Paper

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