Bulk-micromachined test structure for fast and reliable determination of the lateral thermal conductivity of thin films

Journal of Microelectromechanical Systems

Volumn 16, Issue 3, 2007, Pages 675-683

  La Spina, Luigi ^a   van Herwaarden, Alexander W ^b   Schellevis, Hugo ^a   Wien, Wim H A ^a   Nenadović, Nebojša ^a,c   Nanver, Lis K ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b Xensor Integration   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

Aluminum nitride; Bulk micromachining; Seebeck coefficient; Silicon nitride; Thermal conductivity; Thin films

Indexed keywords

COMPUTER SIMULATION; MICROMACHINING; POLYSILICON; SEEBECK COEFFICIENT; SILICON NITRIDE; THERMAL CONDUCTIVITY; THERMOCOUPLES;

ALUMINUM NITRIDE; BULK-MICROMACHINED TEST STRUCTURE; HEATER RESISTOR;

THIN FILMS;

EID: 34547823598     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.892895     Document Type: Article

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