A low cost bumping method for flip chip assembly and MEMS integration

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 781-786

  Zhang, Jianhua ^a   Wang, Changhai ^b   Zeng, Jun ^b   Pang, Ah Ju ^c  

^a SHANGHAI UNIVERSITY   (China)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

^c GENENTECH INC   (United States)

Author keywords

Bumping; Flexible carrier; Flip chip; Microelectromechanical systems (MEMS)

Indexed keywords

FLIP CHIP DEVICES; MEMS; METAL MELTING; SOLDERING; THERMAL CYCLING;

BUMP SHEAR TEST; CHIP/WAFER BUMPING; FLEXIBLE CARRIER; PARALLEL BONDING; THERMOCOMPRESSION BONDING;

WAFER BONDING;

EID: 36849038911     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.906302     Document Type: Article

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