메뉴 건너뛰기




Volumn 27, Issue 1, 2003, Pages 42-50

Self-alignment of microparts using liquid surface tension - Behavior of micropart and alignment characteristics

Author keywords

Alignment; Alignment accuracy; Assembly; Liquid surface tension; Microparts; Restoring force; Self alignment; Water

Indexed keywords

ELECTROSTATICS; SERVOMECHANISMS; SURFACE TENSION; WATER; WETTING;

EID: 0037217585     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0141-6359(02)00182-4     Document Type: Article
Times cited : (80)

References (7)
  • 1
    • 0033346858 scopus 로고    scopus 로고
    • Self-alignment for microparts assembly using water surface tension
    • Sato K., Hata S., Shimokohbe A. Self-alignment for microparts assembly using water surface tension. Proc. SPIE. 3892:1999;321-329.
    • (1999) Proc. SPIE , vol.3892 , pp. 321-329
    • Sato, K.1    Hata, S.2    Shimokohbe, A.3
  • 2
    • 0029734870 scopus 로고    scopus 로고
    • Two-dimensional micro-self-assembly using the surface tension of water
    • Nagoya: IEEE
    • Hosokawa K., Shimoyama I., Miura H. Two-dimensional micro-self-assembly using the surface tension of water. In: Proceedings of the MEMS97. Nagoya: IEEE; 1996. p. 67-72.
    • (1996) Proceedings of the MEMS97 , pp. 67-72
    • Hosokawa, K.1    Shimoyama, I.2    Miura, H.3
  • 3
    • 0002587297 scopus 로고    scopus 로고
    • Fluidic microassembly using patterned self-assembled monolayers and shape matching
    • Srinivasan U., Howe R.T., Liepmann D. Fluidic microassembly using patterned self-assembled monolayers and shape matching. In: Proceedings of Transducers'99. p. 1170-1173.
    • Proceedings of Transducers'99 , pp. 1170-1173
    • Srinivasan, U.1    Howe, R.T.2    Liepmann, D.3
  • 4
    • 0025550651 scopus 로고
    • Self-aligned flip-chip assembly of photonic devices with electrical and optical connections
    • Wale M.J., Edge C. Self-aligned flip-chip assembly of photonic devices with electrical and optical connections. IEEE Trans. Components Hybrids Manufact. Technol. 13:1990;780-786.
    • (1990) IEEE Trans. Components Hybrids Manufact. Technol. , vol.13 , pp. 780-786
    • Wale, M.J.1    Edge, C.2
  • 5
    • 0030646124 scopus 로고    scopus 로고
    • Assembling process for microscopic components using magnetic force
    • Nagoya: IEEE
    • Ota H., Arai T., Takeda M., Narumiya H., Ohara T. Assembling process for microscopic components using magnetic force. In: Proceedings of the MEMS97. Nagoya: IEEE; 1997. p. 209-214.
    • (1997) Proceedings of the MEMS97 , pp. 209-214
    • Ota, H.1    Arai, T.2    Takeda, M.3    Narumiya, H.4    Ohara, T.5
  • 7
    • 0004070357 scopus 로고
    • Kyoritsu Shuppan; [in Japanese]
    • Ono S. Surface tension, Kyoritsu Shuppan; 1980 [in Japanese].
    • (1980) Surface tension
    • Ono, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.