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Volumn E84-C, Issue 12, 2001, Pages 1967-1974

Self-alignment process using liquid resin for assembly of electronic or optoelectronic devices

Author keywords

Joint geometry; Oe mcms; Resin; Self alignment; Surface tension

Indexed keywords


EID: 0005328432     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (8)

References (20)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.