Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 409-414

  Chu, Kun Mo ^a   Choi, Jung Hwan ^a   Lee, Jung Sub ^a   Cho, Han Seo ^a,b   Park, Seong Ook ^a   Park, Hyo Hoon ^a   Jeon, Duk Young ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

Coplanar waveguide (CPW); Flip chip bonding; Indium bump; Optical interconnection; Silver; Solder; Vertical cavity surface emitting laser (VCSEL)

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; MICROWAVE INTEGRATED CIRCUITS; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; SEMICONDUCTING INDIUM; SEMICONDUCTOR LASERS;

FLIP-CHIP BONDING; INDIUM SOLDER BUMPS; MICROWAVE TRANSMISSION; OPTOELECTRONIC TRANSMISSION; VERTICAL-CAVITY SURFACE-EMITTING LASER;

FLIP CHIP DEVICES;

EID: 33747601389     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.875417     Document Type: Article

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