3-D large-scale IC/MEMS co-integration using liquid solder for flip-chip assembly

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages

  Chapuis, Y A ^a,b   Debray, A ^c   Fujita, H ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b UNIVERSITÉ DE STRASBOURG   (France)

^c CANON INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CHIP SCALE PACKAGES; CLADDING (COATING); COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTROSTATIC ACTUATORS; FLIP CHIP DEVICES; MEMS; MICROELECTROMECHANICAL DEVICES; NANOSYSTEMS; OPTICAL DESIGN; PHOTORESISTS; SELF ASSEMBLY; SOLDERING; TECHNOLOGY; WELDING;

ASSEMBLY TECHNIQUES; CO-INTEGRATION; CONTAMINATION PROBLEMS; ELECTRONIC CHIPS; ELECTRONIC PACKAGING; FLIP CHIPPING; FLIP-CHIP ASSEMBLIES; FLIP-CHIP PACKAGING; INTERNATIONAL CONFERENCES; LIQUID SOLDERS; MEMS CHIPS; MICRO ACTUATORS; SELF-ALIGNMENT; SELF-ASSEMBLY TECHNIQUES; SOLDER BUMPING;

ELECTRONICS PACKAGING;

EID: 50249133601     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2007.4441382     Document Type: Conference Paper

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