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Volumn , Issue , 2008, Pages 10-12

Three-dimensional integration technology using self-assembly technique and super-chip integration

Author keywords

Chip to wafer bonding; Self assembly; Super chip; Three dimensional (3 D) LSI; Through silicon via (TSV)

Indexed keywords

COMPUTER NETWORKS; INTEGRATION; SELF ASSEMBLY; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS; THREE DIMENSIONAL;

EID: 50949112833     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546910     Document Type: Conference Paper
Times cited : (2)

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  • 3
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.