Damage mechanics of electromigration induced failure

Mechanics of Materials

Volumn 40, Issue 1-2, 2008, Pages 66-79

  Basaran, Cemal ^a   Lin, Minghui ^a  

^a State University of New York   (United States)

Author keywords

Current crowding; Damage mechanics; Electromigration; High current density; Nanoelectronics; Solder joint

Indexed keywords

CURRENT DENSITY; FINITE ELEMENT METHOD; NANOELECTRONICS; POWER ELECTRONICS; SOLDERED JOINTS; VISCOPLASTICITY;

CURRENT CROWDING; DAMAGE MECHANICS; HIGH CURRENT DENSITY;

ELECTROMIGRATION;

EID: 34548574836     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechmat.2007.06.006     Document Type: Article

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