Deformation of solder joint under current stressing and numerical simulation - II

International Journal of Solids and Structures

Volumn 41, Issue 18-19, 2004, Pages 4959-4973

  Ye, Hua ^a   Basaran, Cernai ^a   Hopkins, Douglas C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Electromigration; Modeling; Moire inteferometry; Solder joint

Indexed keywords

COMPUTER SIMULATION; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTROMIGRATION; FINITE ELEMENT METHOD; FLIP FLOP CIRCUITS; MATHEMATICAL MODELS; MICROELECTRONICS; STRESS ANALYSIS;

CURRENT STRESSING; ELECTROMIGRATION MODELS; MOIRE INTERFEROMETRY; SPATIAL DISTRIBUTION;

SOLDERED JOINTS;

EID: 10644242622     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2004.04.003     Document Type: Article

References (11)

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