Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures

Volumn 40, Issue 15, 2003, Pages 4021-4032

  Ye, Hua ^a   Basaran, Cemal ^a   Hopkins, Douglas C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Coarsening; Electromigration; Nano indentation; Reliability; Solder joint

Indexed keywords

CATHODES; CURRENT DENSITY; ELECTROMIGRATION; EUTECTICS; MICROELECTRONICS; NUCLEATION; TIN COMPOUNDS;

SURFACE MARKER MOVEMENT;

SOLDERED JOINTS;

MICROELECTRONICS;

EID: 0037670082     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(03)00175-6     Document Type: Article

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