Temperature and current-density distributions in flip-chip solder joints with Cu traces

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 947-953

  Hsu, C Y ^a   Yao, D J ^a   Liang, S W ^b   Chen, Chih ^b   Yeh, Everett C C ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c FrontAnD Technology   (Taiwan)

Author keywords

Current crowding; Electromigration; Flip chip

Indexed keywords

CURRENT CROWDING; CURRENT DENSITY DISTRIBUTION; ELECTROMIGRATION RESISTANCE; FLIP CHIPS;

COPPER; CURRENT DENSITY; ELECTRIC CURRENT DISTRIBUTION; ELECTRIC CURRENTS; ELECTRIC RESISTANCE; ELECTROMIGRATION; FLIP CHIP DEVICES;

SOLDERED JOINTS;

EID: 33745052420     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692552     Document Type: Conference Paper

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