Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

Scripta Materialia

Volumn 57, Issue 6, 2007, Pages 513-516

  Zhang, X F ^a   Guo, J D ^a   Shang, J K ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Abnormal polarity effect; Electromigration; Intermetallic compound

Indexed keywords

POLARITY EFFECTS; SOLDER INTERCONNECTS;

COPPER COMPOUNDS; ELECTRIC DIPOLE MOMENTS; ELECTROMIGRATION; SOLDERED JOINTS; SURFACE CHEMISTRY; TIN COMPOUNDS;

INTERMETALLICS;

EID: 34447262124     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.05.023     Document Type: Article

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