Measurement of high electrical current density effects in solder joints

Microelectronics Reliability

Volumn 43, Issue 12, 2003, Pages 2021-2029

  Ye, Hua ^a   Hopkins, Douglas C ^a   Basaran, Cemal ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; INTERFEROMETRY; MICROELECTRONICS; STRAIN; THERMAL STRESS;

DAMAGE MECHANICS;

SOLDERED JOINTS;

EID: 0242335114     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00131-8     Document Type: Article

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