SCOPUS 정보 검색 플랫폼

Volumn 99, Issue 2, 2006, Pages

Electromigration in Pb-free flip chip solder joints on flexible substrates

Author keywords

[No Author keywords available]

Indexed keywords

BUMP METALLURGY; CATHODE INTERFACES; PB-FREE FLIP CHIP SOLDER JOINTS; VOID MIGRATION;

CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; LEAD; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

SOLDERED JOINTS;

EID: 31644434548 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.2163982 Document Type: Article

Times cited : (38)

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