Fabrication of the flexible sensor using SOI wafer by removing the thick silicon layer

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn 2006, Issue , 2006, Pages 122-125

  Noda, Kentaro ^a   Hoshino, Kazunori ^a   Matsumoto, Kiyoshi ^a   Shimoyama, Isao ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER BEAMS; ELASTICITY; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; SHEAR STRESS; SINGLE CRYSTALS;

FLEXIBLE SENSORS; PIEZORESISTIVE CANTILEVERS; THICK SILICON LAYERS; THIN SILICON STRUCTURES;

SILICON WAFERS;

EID: 33750130306     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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