Low temperature fabrication of immersion capacitive micromachined ultrasonic transducers on silicon and dielectric substrates

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 51, Issue 10, 2004, Pages 1324-1333

  Knight, Joshua ^a   McLean, Jeff ^a   Degertekin, F Levent ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS (CMUT); INTRAVASCULAR ULTRASOUND (IVUS); OPTICAL REFLECTIVITY; VACCUM CAVITY;

CAPACITANCE; CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; MICROMACHINING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON; SILICON WAFERS; ULTRASONICS;

ULTRASONIC TRANSDUCERS;

EID: 8344253627     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2004.1350961     Document Type: Article

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