The microfabrication of capacitive ultrasonic transducers

Journal of Microelectromechanical Systems

Volumn 7, Issue 3, 1998, Pages 295-302

  Jin, Xuecheng ^{a,b,c,d,e,f,g}   Ladabaum, Igal ^{a,b,e,h,i,j,k}   Khuri Yakub, Butrus T ^{a,b,e,f,k,l,m}  

^a IEEE

^b STANFORD UNIVERSITY   (United States)

^c TSINGHUA UNIVERSITY   (China)

^d NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^e STANFORD UNIVERSITY   (United States)

^f Oriental Star Microcomputers ^*  (United States)

^g TEXAS INSTRUMENTS   (United States)

^h UNIVERSITY OF CALIFORNIA   (United States)

ⁱ ECOLE POLYTECHNIQUE   (France)

^j AIR LIQUIDE   (France)

^k ACOUSTICAL SOCIETY OF AMERICA   (United States)

^l AMERICAN UNIVERSITY OF BEIRUT   (Lebanon)

^m DARTMOUTH COLLEGE   (United States)

more..

Author keywords

Capacitive ultrasonic transducer; Fabrication process; Sacrificial etching; Surface micromachining; Vacuum sealing

Indexed keywords

AMORPHOUS SILICON; COMPUTER SIMULATION; ELECTRONIC EQUIPMENT TESTING; ETCHING; MICROELECTRONIC PROCESSING; MICROMACHINING; PHOTOLITHOGRAPHY; SIGNAL TO NOISE RATIO; VACUUM APPLICATIONS;

CAPACITIVE ULTRASONIC TRANSDUCERS; SACRIFICIAL ETCHING;

ULTRASONIC TRANSDUCERS;

EID: 0032162663     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.709646     Document Type: Article

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