Latest results from the SEMATECH Berkeley extreme ultraviolet microfield exposure tool

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 27, Issue 1, 2009, Pages 66-70

  Naulleau, Patrick P ^a   Anderson, Christopher N ^b   Chiu, Jerrin ^a   Dean, Kim ^c   Denham, Paul ^a   George, Simi ^a   Goldberg, Kenneth A ^a   Hoef, Brian ^a   Jones, Gideon ^a   Koh, Chawon ^c   La Fontaine, Bruno ^d   Ma, Andy ^e   Montgomery, Warren ^c   Niakoula, Dimitra ^a   Park, Joo On ^f   Wallow, Tom ^c   Wurm, Stefan ^d  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c SEMATECH   (United States)

^d ADVANCED MICRO DEVICES   (United States)

^e INTEL CORPORATION   (United States)

^f SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICALLY AMPLIFIED PHOTORESISTS; EXPOSURE TOOLS; EXTREME ULTRA VIOLETS; LINE EDGE ROUGHNESS; NUMERICAL APERTURES; RESIST DEVELOPMENT; SEMATECH; SPACE IMAGING;

EXPOSURE METERS; LASER PULSES; ROUGHNESS MEASUREMENT; ULTRAVIOLET DEVICES;

PHOTORESISTS;

EID: 59949105349     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3043473     Document Type: Article

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