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1
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84893954191
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S. Wurm, EUV lithography development in the United States, presented at the Fourth International EUV Lithography Symposium, San Diego, Calif., 7-9 November 2005, proceedings available from SEMATECH, Austin, Tex.
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S. Wurm, "EUV lithography development in the United States," presented at the Fourth International EUV Lithography Symposium, San Diego, Calif., 7-9 November 2005, proceedings available from SEMATECH, Austin, Tex.
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2
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84893903508
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EUV lithography update
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presented at the, Austin, Tex
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S. Wurm, "EUV lithography update," presented at the Fifth International Symposium on EUV Lithography, Barcelona, Spain, 15-18 October 2006, proceedings available from SEMATECH, Austin, Tex.
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Fifth International Symposium on EUV Lithography, Barcelona, Spain, 15-18 October 2006, proceedings available from SEMATECH
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Wurm, S.1
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3
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3843090432
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Resolution limitations in chemically amplified photoresist systems
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G. M. Schmid, M. D. Stewart, C. Wang, B. D. Vogt, M. Vivek, E. K. Lin, and C. G. Willson, "Resolution limitations in chemically amplified photoresist systems," Proc. SPIE 5376, 333-342 (2004).
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Proc. SPIE
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, pp. 333-342
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Schmid, G.M.1
Stewart, M.D.2
Wang, C.3
Vogt, B.D.4
Vivek, M.5
Lin, E.K.6
Willson, C.G.7
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4
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33845445028
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Spectral analysis of line width roughness and its applications to immersion lithography
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G. F. Lorusso, P. Leunissen, M. Ercken, C. Delvaux, F. V. Roey, and N. Vandenbroeck, "Spectral analysis of line width roughness and its applications to immersion lithography," J. Microlithogr., Microfab., Microsyst. 5, 033003 (2006).
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J. Microlithogr., Microfab., Microsyst
, vol.5
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Lorusso, G.F.1
Leunissen, P.2
Ercken, M.3
Delvaux, C.4
Roey, F.V.5
Vandenbroeck, N.6
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5
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35148855730
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Lithographic metrics for the determination of intrinsic resolution limits in EUV resists
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P. Naulleau and C. Anderson, "Lithographic metrics for the determination of intrinsic resolution limits in EUV resists," Proc. SPIE 6517, 65172N (2007).
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(2007)
Proc. SPIE
, vol.6517
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Naulleau, P.1
Anderson, C.2
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6
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0141611994
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Characterization of photoresist spatial resolution by interferometric lithography
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J. Hoffnagle, W. D. Hinsberg, F. A. Houle, and M. I. Sanchez, "Characterization of photoresist spatial resolution by interferometric lithography," Proc. SPIE 5038, 464-472 (2003).
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(2003)
Proc. SPIE
, vol.5038
, pp. 464-472
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Hoffnagle, J.1
Hinsberg, W.D.2
Houle, F.A.3
Sanchez, M.I.4
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7
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3843054532
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Impact of resist blur on MEF, OPC, and PD control
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T. Brunner, C. Fonseca, N. Seong, and M. Burkhardt, "Impact of resist blur on MEF, OPC, and PD control," Proc. SPIE 5377, 141-149 (2004).
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(2004)
Proc. SPIE
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, pp. 141-149
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Brunner, T.1
Fonseca, C.2
Seong, N.3
Burkhardt, M.4
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8
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3843140407
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Determination of resist parameters using the extended Nijboer-Zernike theory
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P. Dirksen, J. Braat, A. J. E. M. Janssen, A. Leeuwestein, H. Kwinten, and D. Van Steenwinckel, "Determination of resist parameters using the extended Nijboer-Zernike theory," Proc. SPIE 5377, 150-159 (2004).
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Dirksen, P.1
Braat, J.2
Janssen, A.J.E.M.3
Leeuwestein, A.4
Kwinten, H.5
Van Steenwinckel, D.6
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9
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0141498455
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Theoretical corner rounding analysis and mask writer simulation
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R. Jones and J. Byers, "Theoretical corner rounding analysis and mask writer simulation," Proc. SPIE 5040, 1035-1043 (2003).
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(2003)
Proc. SPIE
, vol.5040
, pp. 1035-1043
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Jones, R.1
Byers, J.2
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10
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25144522920
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Novel approximate model for resist process
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C. Ahn, H. Kim, and K. Baik, "Novel approximate model for resist process," Proc. SPIE 3334, 752-763 (1998).
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(1998)
Proc. SPIE
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, pp. 752-763
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Ahn, C.1
Kim, H.2
Baik, K.3
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11
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3843137187
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Status of EUV micro-exposure capabilities at the ALS using the 0.3-NA MET optic
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P. Naulleau, "Status of EUV micro-exposure capabilities at the ALS using the 0.3-NA MET optic," Proc. SPIE 5374, 881-891 -(2004).
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(2004)
Proc. SPIE
, vol.5374
, pp. 881-891
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Naulleau, P.1
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12
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13244265984
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At-wavelength alignment and testing of the 0.3 NA MET optic
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K. Goldberg, P. Naulleau, P. Denham, S. Rekawa, K. Jackson, E. Anderson, and J. A. Liddle, "At-wavelength alignment and testing of the 0.3 NA MET optic," J. Vac. Sci. Technol. B 22, 2956-2961 (2004).
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(2004)
J. Vac. Sci. Technol. B
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Goldberg, K.1
Naulleau, P.2
Denham, P.3
Rekawa, S.4
Jackson, K.5
Anderson, E.6
Liddle, J.A.7
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13
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84893914906
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As an external control, all experimental and modeling corner data are taken at and around the dose where the coded 100 nm features print at 100 nm
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As an external control, all experimental and modeling corner data are taken at and around the dose where the coded 100 nm features print at 100 nm.
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14
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84893904347
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Note that commercial modeling packages such as PROLITH and SOLID E could also be used
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Note that commercial modeling packages such as PROLITH and SOLID E could also be used.
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