Recent progress of thermal interface materials

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 351-358

  Liu, Johan ^a,b   Wang, Teng ^a   Carlberg, Björn ^a   Inoue, Masahiro ^c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT; TECHNOLOGICAL FORECASTING;

INTERFACE MATERIALS; RECENT PROGRESSES; RESEARCH AND DEVELOPMENTS; RESEARCH WORKS;

THERMAL INSULATING MATERIALS;

EID: 58149097876     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684374     Document Type: Conference Paper

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