Nanostructured polymer-metal composite for thermal interface material applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 191-197

  Carlberg, Björn ^a   Wang, Teng ^a   Fu, Yifeng ^a   Liu, Johan ^a,b   Shangguan, Dongkai ^b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; CARBON FIBER REINFORCED PLASTICS; COMPUTER NETWORKS; ELECTRONIC EQUIPMENT; FATIGUE OF MATERIALS; INDUSTRIAL MANAGEMENT; JOINTS (STRUCTURAL COMPONENTS); MICROELECTRONICS; PACKAGING MATERIALS; POLYMERS; THERMAL INSULATING MATERIALS; THERMOELECTRICITY;

INTERFACE MATERIALS; NANO-STRUCTURED;

POLYMER MATRIX COMPOSITES;

EID: 51349087861     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549969     Document Type: Conference Paper

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