Thermal interface material technology advancements and challenges - An overview

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 511-516

  Dani, Ashay ^a   Matayabas Jr , James C ^a   Koning, Paul ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; HEAT LOSSES; MICROPROCESSOR CHIPS; SERVERS; TRANSISTORS;

MICROPROCESSOR ARCHITECTURE; PHASE CHANGE MATERIALS (PCM);

MICROELECTROMECHANICAL DEVICES;

EID: 32844472118     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73384     Document Type: Conference Paper

References (5)

1. R. Mahajan, R. Nair, V. Wakharkar, J. Swan, J. Tang, "Emerging Directions for Packaging Technologies", Intel Technology Journal, Vol. 6(2), 62-75, 2002
2. C. P. Chiu, B. Chandran, M. Mello, K. Kelley, 'An accelerated Reliability Test Method to Predict Thermal Grease Pump-out in Flip Chip Applications', ECTC, 2001
3. C. P. Chiu, G. L. Solbrekken, V. Lebonheur, Y. E. Xu, "Application of Phase-Change Materials in Pentium III an Pentium III Xeon Processor Cartridges", International Symposium on Advanced Packaging Materials, 2000.
4. J. C. Matayabas Jr., A. Dani. P. Koning, C. Rumer, 'Gel TIM comprising fillers having low melting point and electronic packages having these Gel TIM", Intel Patent 6,841,867, Jan, 2005.
5. C. Deppisch, S. Houle, 'An Electronic Assembly having solder thermal interface between die, substrate and a heat spreader", Intel Patents 6,817,091 and 6, 504, 723