Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1999, Pages 83-97

  Campbell, Robert C ^a   Smith, Stephen E ^a   Dietz, Raymond L ^a  

^a Holometrix Micromet   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; LASER APPLICATIONS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL VARIABLES MEASUREMENT;

LASER FLASH METHOD;

ADHESIVE JOINTS;

EID: 0032681047     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)