A numerical study of transport in a thermal interface material enhanced with carbon nanotubes

Journal of Electronic Packaging

Volumn 128, Issue 1, 2006, Pages 92-97

  Desai, Anand ^a   Mahajan, Sanket ^b   Subbarayan, Ganesh ^b   Jones, Wayne ^a   Geer, James ^a   Sammakia, Bahgat ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b Purdue University   (United States)

Author keywords

Analytical modeling; Carbon nanotubes; Molecular dynamic simulations; Numerical modeling; Thermal interface material (TIM); Thermal management

Indexed keywords

CARBON NANOTUBES; COMPUTER SIMULATION; ELECTRIC LOSSES; MOLECULAR DYNAMICS; PERFORMANCE; POWER ELECTRONICS;

MOLECULAR DYNAMIC SIMULATIONS; NUMERICAL MODELING; THERMAL INTERFACE MATERIAL; THERMAL MANAGEMENT;

INTERFACES (MATERIALS);

EID: 33645976164     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2161231     Document Type: Article

References (5)

1. Iijima, S., 1991, Nature (London), 354, p. 56.
2. Berber, S., Kwon, Y.-K., and Tománek, D., 2000, "Unusually High Thermal Conductivity of Nanotubes," Phys. Rev. Lett., 84, p. 4613.
3. Desai, A., Geer, J., and Sammakia, B., "Models of Steady Heat Conduction in Multiple Cylindrical Domains," J. Electron. Packag. (to be published).
4. Mahajan, S., Subbarayan, G., Sammakia, B. G., and Jones, W., 2000, Proceedings of 2003 ASME, International Mechanical Engineering Congress and Exposition, Washington, D.C., November 15-21.
5. ANSYS Manual, 2003, Sec. 11.3.