Investigation of carbon nanotube performance under external mechanical stresses and moisture

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Fan, Haibo ^a   Zhang, Kai ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; MOISTURE; MOLECULAR DYNAMICS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

HIGH INTERFACIAL STRESSES; MECHANICAL STRESSES; THERMAL DISSIPATION; THERMAL EXPANSION COEFFICIENT; THERMAL INTERFACE MATERIAL (TIM);

CARBON NANOTUBES;

EID: 36349036049     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360034     Document Type: Conference Paper

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