Materials for thermal management properties and processes

Advanced Packaging

Volumn 12, Issue 3, 2003, Pages 15-20

  Dean, Nancy ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT RESISTANCE; HEAT TRANSFER; SEMICONDUCTOR DEVICES; THERMAL EFFECTS;

THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0037349756     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (10)

1. International Technology Roadmap for Semiconductors, 2000 update, Assembly and Packaging, Semiconductor Industry Association (SIA), 2000.
2. N. Dean and I. Rasiah, "Trends in Thermal Interface Materials," ICMAT 2001, Singapore.
3. Pentium Processor Thermal Design Guidelines, Report 8019, Intel Corp, Santa Clara, CA, 1994.
4. Pentium III Processor Thermal Design Guide, Intel Corp, Santa Clara, CA, 2000.
5. Chiu, CP, Solbrekken, GL, et al., "Thermal Design of Pentium II Xeon Processor Cartridge," IMAPS Symposium, 1999, pp758-763.
6. Dolbear, TP and Tarter, T, "Thermal Management of Pin Grid Array Packaging Flip Chip Connected X86 Microprocessors," ISPS 97 Proceedings, IEEE, P. 279.
7. AMD Publication 23794, "Athlon Thermal, Mechanical and Chassis Cooling Design Guide," Advanced Micro Devices, 2000.
8. AMD publication 21085, "AMD-K6 Processor Thermal Design Guide," Advanced Micro Devices, 1999.
9. AMD publication 20092, "AMD-K5 Processor Thermal Considerations," Advanced Micro Devices, 1996.
10. M. Touzelbaev and K. Goodson, "Photon Transport in Superlattices," ICMAT, Symposium J - Packaging Materials & processes for Microelectronics, Optoelectronics, MEMS and Displays, Singapore, 2001.