An analytical study of transport in a thermal interface material enhanced with carbon nanotubes

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 403-409

  Desai, Anand ^a   Mahajan, Sanket ^b   Subbarayan, Ganesh ^b   Jones, Wayne ^a   Geer, James ^a   Sammakia, Bahgat ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b PURDUE UNIVERSITY   (United States)

Author keywords

Analytical modeling; Carbon Nanotubes; Molecular Dynamic Simulations; Numerical modeling; Thermal interface material (TIM); Thermal Management

Indexed keywords

MOLECULAR DYNAMIC SIMULATIONS; THERMAL INTERFACE MATERIALS (TIM); THERMAL MANAGEMENT;

CARBON NANOTUBES; COMPUTER SIMULATION; ENERGY DISSIPATION; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; MOLECULAR DYNAMICS; THERMAL CONDUCTIVITY;

HEAT TRANSFER;

EID: 4444255467     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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9. Desai.A, "A study of Nanostructures Enhanced Thermal Interface Material", Fall 2003, M.S Thesis, Binghamton University.
10. S. Mahajan, G. Subbarayan, B.G. Sammakia, and W. Jones, Proceedings of 2003 ASME, International Mechanical Engineering Congress and Exposition, Washington, D.C., USA; November 15-21, 2003.
11. Refer the Ansys Manual (2003), section 11.3