Advanced Boron Nitride epoxy formulations excel in thermal management applications

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 1, Issue , 1999, Pages 359-366

  Hodgin, Michael J ^a   Estes, Richard H ^a  

^a Epoxy Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BORON COMPOUNDS; EPOXY RESINS; HEAT RESISTANCE; MORPHOLOGY; PLASTICS FILLERS; RHEOLOGY; SHEAR STRENGTH; STRESS ANALYSIS; THERMAL CYCLING; VISCOSITY;

ADVANCED BORON NITRIDE EPOXY;

ELECTRONICS PACKAGING;

EID: 0032684156     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)