Challenges in thermal interface material testing

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 42-49

  Lasance, Clemens J M ^a   Murray, Cameron T ^b   Saums, David L ^c   Rencz, Marta ^d  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b 3M COMPANY   (United States)

^c DS and A LLC   (United States)

^d BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Steady state Thermal Testing; Thermal Interface Materials; Thermal Resistance; Transient Method Thermal Testing

Indexed keywords

HEAT RESISTANCE; SEMICONDUCTOR DEVICES; THERMODYNAMIC PROPERTIES; THICKNESS MEASUREMENT;

CHARACTERIZATION EQUIPMENT; STEADY STATE THERMAL TESTING; THERMAL INTERFACE MATERIALS (TIM); TRANSIENT METHOD THERMAL TESTING;

INTERFACES (MATERIALS);

EID: 33750143844     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/stherm.2006.1625204     Document Type: Conference Paper

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