The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

JOM

Volumn 58, Issue 6, 2006, Pages 67-74

  Deppisch, Carl ^a   Fitzgerald, Thomas ^a   Raman, Arun ^a   Hua, Fay ^a   Zhang, Charles ^a   Liu, Pilin ^a   Miller, Mikel ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INDIUM SOLDER; SCANNING-ACOUSTIC MICROSCOPY; THERMAL INTERFACE MATERIALS;

FAILURE ANALYSIS; HEAT RESISTANCE; INDIUM ALLOYS; INTERFACES (MATERIALS); METALLIZING; SCANNING ELECTRON MICROSCOPY; THERMAL CONDUCTIVITY; THERMAL CYCLING; TRANSMISSION ELECTRON MICROSCOPY;

SOLDERING ALLOYS;

EID: 33745298424     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-006-0186-6     Document Type: Article

References (9)

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9. M. Hanson, Constitution of Binary Alloys, 2nd edition (New York, NY: McGraw-Hill Co., 1958).