Micron and sub-micron scale characterization of interfaces in thermal interface material systems

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 556-563

  Gowda, Arun ^a   Esler, David ^b   Tonapi, Sandeep ^b   Zhong, Annita ^b   Srihari, K ^a   Schattenmann, Florian ^b  

^a State University of New York at Binghamton   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

Acoustic microscopy; Interfacial resistance; Radiography; SEM; Thermal interface materials

Indexed keywords

BONDLINE THICKNESS (BLT); INTERFACIAL RESISTANCE; PHONON REFLECTANCE; THERMAL INTERFACE MATERIAL (TIM);

ACOUSTIC MICROSCOPES; COMPUTERIZED TOMOGRAPHY; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; PHONONS; RADIOGRAPHY; SCANNING ELECTRON MICROSCOPY;

ELECTRONICS PACKAGING;

EID: 4444278721     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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