Micron and submicron-scale characterization of interfaces in thermal interface material systems

Journal of Electronic Packaging

Volumn 128, Issue 2, 2006, Pages 130-136

  Gowda, Arun ^a   Esler, David ^a   Tonapi, Sandeep ^a   Zhong, Annita ^a   Srihari, K ^b   Schattenmann, Florian ^a  

^a GE GLOBAL RESEARCH   (United States)

^b State University of New York at Binghamton   (United States)

Author keywords

Acoustic microscopy; Interfacial resistance; Radiography; SEM; Thermal interface materials

Indexed keywords

ACOUSTIC MICROSCOPES; HEAT SINKS; INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; RADIOGRAPHY; SCANNING ELECTRON MICROSCOPY; THERMOANALYSIS;

COLD PLATE; HEAT SPREADER; INTERFACIAL RESISTANCE; THERMAL INTERFACE MATERIALS;

ELECTRONICS PACKAGING;

EID: 33845712540     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2188952     Document Type: Article

References (10)

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