Effects of assembly process variables on voiding at a thermal interface

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 58-62

  Mukadam, Muffadal ^a   Schake, Jeff ^b   Borgesen, Peter ^c   Srihari, Krishnaswami ^a  

^a State University of New York at Binghamton   (United States)

^b DEK USA Inc   (United States)

^c UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

Deposit shape; Dispensing; Stencil printing; Thermal interface material; Voiding

Indexed keywords

HEAT SPREADERS; STENCIL PRINTING; THERMAL INTERFACE MATERIALS (TIM);

ACOUSTIC MICROSCOPES; FLIP CHIP DEVICES; HEAT FLUX; HEAT RESISTANCE; INTERFACES (MATERIALS); SEMICONDUCTOR DEVICE MANUFACTURE;

HEAT TRANSFER;

EID: 4444255504     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Kohli, P., Sobezak, M., Bowin, J., Mathews, M., "Advanced Thermal Interface Materials for Enhanced Flip Chip BGA", 2001 Electronics Component Technology Conference, Orlando, FL, May 2001.
2. Ramakrishna, K., Lee, T., "An Evaluation of Thermal Enhancements to Flip-Chip-Plastic-Ball-Grid-Array (FCBGA) Packages", 2003 ASME International Mechanical Engineering Congress, Washington, D. C., November 2003.
3. Pinjala, D., Khan, N., Ling, X., Teo, P., Wong, E., Iyer, M., Lee, C., Rasiah, I., "Thermal Design of Heat Spreader and Analysis of Thermal Interface Materials (TIM) for Multi-Chip Package, 2002 Electronics Components and Technology Conference, San Diego, CA, May 2002.
4. Area Array Consortium 2004, www.uic.com