Phase change materials as a viable thermal interface material for high-power electronic applications

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 687-691

  Ramaswamy, Chandrashekhar ^a   Shinde, Subhash ^a   Pompeo, Frank ^a   Sablinski, William ^a   Bradley, Scott ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONIC MODULES; PHASE CHANGE MATERIALS (PCM); PHASE TRANSITION TEMPERATURES; THERMAL INTERFACE MATERIALS (TIM);

BENCHMARKING; INTERFACES (MATERIALS); MICROELECTRONICS; MULTICHIP MODULES; PARAMETER ESTIMATION; PHASE TRANSITIONS; PYROLYSIS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

POWER ELECTRONICS;

EID: 4444358836     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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