Analysis of phase change material for use as thermal interface material

International Journal of Polymer Analysis and Characterization

Volumn 9, Issue 4, 2004, Pages 213-228

  Nurmawati, M H ^a   Siow, K S ^a   Rasiah, I J ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b HONEYWELL   (United States)

Author keywords

Heat capacity; Phase change material; Thermal analysis; Thermal interface material; Thermal resistance

Indexed keywords

ANALYTIC METHOD; ARTICLE; COOLING; ELECTRONICS; ENTHALPY; HEAT TOLERANCE; HEAT TRANSFER; MELTING POINT; PHASE TRANSITION; SEMICONDUCTOR; TEMPERATURE DEPENDENCE; THEORETICAL MODEL; THERMAL CONDUCTIVITY;

EID: 18844386536     PISSN: 1023666X     EISSN: None     Source Type: Journal    
DOI: 10.1080/10236660490920219     Document Type: Article

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