Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows

Journal of Electronic Materials

Volumn 35, Issue 12, 2006, Pages 2126-2134

  Chen, Zhong ^a   Kumar, Aditya ^a   Mona, M ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electroless nickel; Interfacial reactions; Intermetallic compounds (IMCs); Lead free solder; Mechanical strength

Indexed keywords

ELECTROLESS NICKEL; INTERFACIAL REACTIONS; LEAD-FREE SOLDER;

COPPER; ELECTROLESS PLATING; INTERMETALLICS; MICROSTRUCTURE; NICKEL; SOLDERED JOINTS; STRENGTH OF MATERIALS; SURFACE CHEMISTRY; TEMPERATURE DISTRIBUTION;

PHOSPHORUS;

EID: 33846449891     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0322-7     Document Type: Conference Paper

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