Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

Journal of Electronic Materials

Volumn 35, Issue 10, 2006, Pages 1812-1817

  Sharif, Ahmed ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Ball grid array (BGA) solder joints; Extended reflow; Shearing load; Sn Zn based lead free alloys

Indexed keywords

INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); METALLIZING; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING ALLOYS;

BALL GRID ARRAY (BGA) SOLDER JOINTS; EXTENDED REFLOW; SHEARING LOAD; SN-ZN-BASED LEAD-FREE ALLOYS;

INTERFACES (MATERIALS);

EID: 33750183644     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0162-5     Document Type: Article

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