Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1284-1289

  Chen, Sinn Wen ^a   Lee, Shou Wei ^a   Yip, Ming Chuen ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Interfacial reactions; Mechanical properties; Ni Sn Ni; Sn Cu solder

Indexed keywords

ANNEALING; FRACTURE; INTERFACES (MATERIALS); INTERMETALLICS; MECHANICAL PROPERTIES; NICKEL; TENSILE STRENGTH; THICKNESS MEASUREMENT; TIN;

COPPER NICKEL JOINTS; COPPER TIN COMPOUNDS; JOINT STRENGTH; NICKEL TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 0346216011     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0024-3     Document Type: Article

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