Solid state interfacial reaction and joint strength of Sn-37Pb solder with Ni-P under bump metallization in flip chip application

Journal of Alloys and Compounds

Volumn 395, Issue 1-2, 2005, Pages 80-87

  Kim, Dae Gon ^a   Kim, Jong Woong ^a   Lee, Jung Goo ^b   Mori, Hirotaro ^b   Quesnel, David J ^c   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b OSAKA UNIVERSITY   (Japan)

^c University of Rochester   (United States)

Author keywords

Finite element modeling; Flip chip; Interfacial reaction; Shear test; Sn 37Pb

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; FINITE ELEMENT METHOD; INTERMETALLICS; MATHEMATICAL MODELS; METALLIZING; MICROSTRUCTURE; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

FLIP CHIPS; INTERFACIAL REACTIONS; SHEAR TESTS; SN-37PB;

TIN ALLOYS;

EID: 18244384045     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2004.11.038     Document Type: Article

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