Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 4, 2006, Pages 886-891

  Kumar, Aditya ^a   Chen, Zhong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electroless nickel; Interfacial reaction; Metallization; Reliability; Solder; Tensile strength

Indexed keywords

AGING OF MATERIALS; BRITTLE FRACTURE; COPPER; ELECTROLESS PLATING; INTERMETALLICS; METALLIZING; RELIABILITY; SURFACE CHEMISTRY; TENSILE STRENGTH;

AGING DURATION; ELECTROLESS NICKEL; MECHANICAL RELIABILITY; SOLDER JOINT STRENGTH;

SOLDERED JOINTS;

EID: 33947257921     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.886847     Document Type: Article

References (17)

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