Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Materials Science and Engineering: A

Volumn 423, Issue 1-2, 2006, Pages 175-179

  Kumar, Aditya ^a   Chen, Zhong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electroless nickel; Interfacial reactions; Mechanical reliability; Solder

Indexed keywords

BRITTLENESS; COPPER; DUCTILITY; FRACTURE; HIGH TEMPERATURE OPERATIONS; INTERMETALLICS; NICKEL; PHASE TRANSITIONS; PHOSPHORUS; TENSILE STRENGTH; TERNARY SYSTEMS; TIN ALLOYS;

ELECTROLESS NICKEL; MECHANICAL RELIABILITY; SOLID-STATE INTERFACIAL REACTIONS;

SOLDERED JOINTS;

BRITTLENESS; COPPER; DUCTILITY; FRACTURE; HIGH TEMPERATURE OPERATIONS; INTERMETALLICS; NICKEL; PHASE TRANSITIONS; PHOSPHORUS; SOLDERED JOINTS; TENSILE STRENGTH; TERNARY SYSTEMS; TIN ALLOYS;

EID: 33646151148     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.12.040     Document Type: Article

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