On the elastic assumption for copper lines in interconnect stress modeling

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 3, 2008, Pages 600-607

  Shen, Yu Lin ^a  

^a MSC01 1070   (United States)

Author keywords

Copper (Cu); Finite element methods; Interconnects; Modeling; Stress

Indexed keywords

ABS RESINS; ELASTOPLASTICITY; FINITE ELEMENT METHOD; PLASTICS; YIELD STRESS;

BARRIER LAYERS; COPPER LINES; CU LINES; ELASTIC-PLASTIC; EXPERIMENTAL OBSERVATIONS; FINITE ELEMENT METHODS; FINITE-ELEMENT MODELING; INTERCONNECT LINES; INTERCONNECT STRUCTURES; INTERCONNECTS; K DIELECTRICS; LINEAR RESPONSES; MATERIAL MODELS; METALLIZATION; MODELING; SIMULATION RESULTS; TEMPERATURE HISTORIES;

COPPER;

EID: 54949127548     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.2002360     Document Type: Article

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