Electromigration-induced plastic deformation in Cu damascene interconnect lines as revealed by synchrotron X-ray microdiffraction

Materials Research Society Symposium Proceedings

Volumn 914, Issue , 2006, Pages 295-304

  Budiman, Arief S ^a   Tamura, N ^b   Valek, B C ^b   Gadre, K ^c   Maiz, J ^c   Spolenak, R ^d   Patel, J R ^a,b   Nix, W D ^a  

^a Stanford University   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c INTEL CORPORATION   (United States)

^d ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CORRELATION METHODS; ELECTROMIGRATION; MICROSTRUCTURE; OPTICAL INTERCONNECTS; POLYCRYSTALLINE MATERIALS; SYNCHROTRON RADIATION;

CU POLYCRYSTALLINE LINES; ELECTROMIGRATION-INDUCED PLASTICITY; GRAIN BENDING; SUBGRAIN STRUCTURES;

PLASTIC DEFORMATION;

EID: 33749643538     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0914-f06-05     Document Type: Conference Paper

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