XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer

International Journal of Machine Tools and Manufacture

Volumn 48, Issue 15, 2008, Pages 1678-1687

  Zong, W J ^a   Sun, T ^a   Li, D ^a   Cheng, K ^a,b   Liang, Y C ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b BRUNEL UNIVERSITY   (United Kingdom)

Author keywords

Diamond like carbon; Groove; Nanometric cutting; SiC; Silicon wafer; Tool wear

Indexed keywords

ANISOTROPY; CARBON; CONCENTRATION (PROCESS); CRYSTAL CUTTING; CRYSTAL ORIENTATION; DIAMOND CUTTING TOOLS; DIAMONDS; DIFFUSION; POWDERS; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DOPING; SILICON; SILICON CARBIDE; SURFACE DIFFUSION; TRIBOLOGY; X RAY PHOTOELECTRON SPECTROSCOPY;

DIAMOND-LIKE CARBON; GROOVE; NANOMETRIC CUTTING; SIC; SILICON WAFER; TOOL WEAR;

SILICON WAFERS;

EID: 53149100816     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2008.06.008     Document Type: Article

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