Effect of crystalline orientation in the ductile-regime machining of silicon

International Journal of Advanced Manufacturing Technology

Volumn 16, Issue 12, 2000, Pages 871-876

  Hung, N P ^a   Fu, Y Q ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER ALLOYS; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; DIAMOND CUTTING TOOLS; DUCTILITY; INTERFEROMETERS; ION BEAMS; LATTICE CONSTANTS; MACHINING; SILICON WAFERS; SURFACE ROUGHNESS;

DUCTILE-REGIME (DR) MACHINING;

COMPUTER INTEGRATED MANUFACTURING;

EID: 0033644945     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s001700070004     Document Type: Article

References (14)

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