The material removal mechanism in mechanical lapping of diamond cutting tools

International Journal of Machine Tools and Manufacture

Volumn 45, Issue 7-8, 2005, Pages 783-788

  Zong, W J ^a   Li, D ^a   Cheng, K ^a,b   Sun, T ^a   Wang, H X ^a   Liang, Y C ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b LEEDS METROPOLITAN UNIVERSITY   (United Kingdom)

Author keywords

Brittle ductile transition; Diamond cutting tools; Material removal mechanism; Mechanical lapping

Indexed keywords

ANISOTROPY; ATOMIC FORCE MICROSCOPY; CRYSTALLOGRAPHY; LAPPING; NANOSTRUCTURED MATERIALS; PHASE TRANSITIONS; REMOVAL; SINGLE CRYSTALS; SURFACES;

BRITTLE-DUCTILE TRANSITION; MATERIAL REMOVAL MECHANISM; MECHANICAL LAPPING; PLASTIC GROOVES;

DIAMOND CUTTING TOOLS;

EID: 13844322266     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2004.11.014     Document Type: Article

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